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Shenzhen Hong Ye Jie Technology Co., Ltd.

Products >> Electronic potting compound silicone rubber

Electronic potting compound silicone rubber

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Description
Product Name: Electronic potting compound silicone rubber
Supply Ability: over 200 kg
Related proudcts electronic potting, electronic potting s, silicone rubber,
Specifications low shrinkage high hardness transparent good tear and tensile
Price Term: CIF
Port of loading: Shen Zhen port
Minimum Order 200kg
Unit Price: 9.19USD/kg

Typical Application of electronic potting compound silicone rubber:
 
electronic potting compound silicone rubber is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Silicone Rubber Electronic Material for good elasticity is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of  PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.
 
Description of electronic potting compound silicone rubber:
 
electronic potting compound silicone rubber is a newly insulating material 
silicon of silicon compounds. It cures without heat, corrosion and just with little shrinkage. 
It can be applied to the sealing and pouring of various electronic components, and then forming insulation system. 
 
Features of electronic potting compound silicone rubber:
 
1. No toxicity, solventless, no odor and no cure by-product.
2. Equal amount of mixing ratio, good fluidity, easy processing.
3. No significant exotherm or shrinkage during curing.

 
Technical Parameters of electronic potting compound silicone rubber:
 
 
 
Before Curing Appearence Black/Tran***rent Fluid
Density(25°C  g/ml) 0.98±0.02
Viscosisty(25°Ccps)        Part A 500±100:Part B:800±100
Mixing Ratio A:B=1:1(By weight)
Operating Time(25°C  hr) 5
Curing time(80°C  hr)  0.5
 
 After Curing Hardness(Shore  A) 0-40
Dielectric Strength(KV/mm) 23
Volume Resistance(Ω.Cm)    1.0×10 15
Permittivity(1.2MHz) 3.0
Temperature Resistence(°C

Contact Us
Company: Shenzhen Hong Ye Jie Technology Co., Ltd.
Contact: Ms. Sandy Yin
Address: Building A, No.3, Hongling First Road, Liulian Shibi, Pingdi
Postcode: 518117
Tel: 86 -0755-89212369
Fax: 86-0755-89948030
E-mail:         


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Tel : 86 -0755-89212369 Fax : 86-0755-89948030
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